Motion control systemManufacturer
Cutting power 1000
Processing width 600 * 600mm
The machining positioning accuracy is ± 0.02mm, and the repeated positioning accuracy of the structure is ± 0.01mm
The maximum cutting speed can reach 30m / min
The notch width is 0.1 ~ 0.05mm, depending on the material
The power consumption of the whole machine is ＜ 6kW
Suitable for cutting wafer, sapphire glass and other materials
- 适用單位： 半導體晶圓、太陽能矽片表面尺寸檢測
- 檢測周期： 1周
微倫科技
Cutting power 1000
Processing width 600 * 600mm
The machining positioning accuracy is ± 0.02mm, and the repeated positioning accuracy of the structure is ± 0.01mm
The maximum cutting speed can reach 30m / min
The notch width is 0.1 ~ 0.05mm, depending on the material
The power consumption of the whole machine is ＜ 6kW
Suitable for cutting wafer, sapphire glass and other materials
适用于(yú)半導體晶圓、太陽能矽片表面尺寸檢測
檢測範圍 4“、6”、8“、12”
檢測精度 TTV ±0.3um
檢測效率120pcs/min
可以(yǐ)自動生産檢測報告
可以(yǐ)結合Wafer ID自動上(shàng)傳數據
适用于(yú)半導體晶圓、太陽能矽片表面尺寸檢測
檢測範圍 4“、6”、8“、12”
檢測精度 TTV ±0.3um
檢測效率120pcs/min
可以(yǐ)自動生産檢測報告
可以(yǐ)結合Wafer ID自動上(shàng)傳數據
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