
precision measurement
适用于(yú)半導體晶圓、太陽能矽片表面尺寸檢測
檢測範圍 4“、6”、8“、12”
檢測精度 TTV ±0.3um
檢測效率120pcs/min
可以(yǐ)自動生産檢測報告
可以(yǐ)結合Wafer ID自動上(shàng)傳數據
- 适用單位: 半導體晶圓、太陽能矽片表面尺寸檢測
- 檢測周期: 1周
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